 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| BUZ 338 SIPMOS (R) Power Transistor * N channel * Enhancement mode * Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 338 VDS 500 V ID 13.5 A RDS(on) 0.4 Package TO-218 AA Ordering Code C67078-S3126-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 13.5 Unit A ID IDpuls 54 TC = 28 C Pulsed drain current TC = 25 C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 13.5 18 mJ ID = 13.5 A, VDD = 50 V, RGS = 25 L = 9.18 mH, Tj = 25 C Gate source voltage Power dissipation 930 VGS Ptot 20 180 V W TC = 25 C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 0.7 75 E 55 / 150 / 56 C K/W 1 07/96 BUZ 338 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 500 3 0.1 10 10 0.3 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 A VDS = 500 V, VGS = 0 V, Tj = 25 C VDS = 500 V, VGS = 0 V, Tj = 125 C Gate-source leakage current IGSS 100 nA 0.4 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 8.5 A Semiconductor Group 2 07/96 BUZ 338 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 8 15 2500 320 120 - S pF 3325 480 180 ns 40 60 VDS 2 * ID * RDS(on)max, ID = 8.5 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Rise time tr 100 150 VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Turn-off delay time td(off) 450 600 VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Fall time tf 120 160 VDD = 30 V, VGS = 10 V, ID = 2.9 A RGS = 50 Semiconductor Group 3 07/96 BUZ 338 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TC = 25 C Inverse diode direct current,pulsed A 1.1 400 6.2 13.5 54 V 1.6 ns C Values typ. max. Unit ISM VSD trr Qrr TC = 25 C Inverse diode forward voltage VGS = 0 V, IF = 27 A Reverse recovery time VR = 100 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 100 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 07/96 BUZ 338 Power dissipation Ptot = (TC) Drain current ID = (TC) parameter: VGS 10 V 14 A 12 190 W 160 Ptot 140 120 100 80 60 40 20 0 0 ID 11 10 9 8 7 6 5 4 3 2 1 0 20 40 60 80 100 120 C 160 0 20 40 60 80 100 120 C 160 TC TC Safe operating area ID = (VDS) parameter: D = 0.01, TC = 25C 10 2 t = 6.8s p 10 s Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 0 A K/W ID /I D ZthJC =V 10 1 DS 100 s 10 -1 R DS (o n) 1 ms D = 0.50 0.20 10 ms 10 0 10 -2 0.10 0.05 0.02 DC 0.01 10 -1 0 10 10 1 10 2 V 10 3 10 -3 -7 10 single pulse 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 s 10 0 VDS tp Semiconductor Group 5 07/96 BUZ 338 Typ. output characteristics ID = (VDS) parameter: tp = 80 s 30 A 26 Typ. drain-source on-resistance RDS (on) = (ID) parameter: VGS 1.3 Ptot = 180Wl j k i hg f e dVGS [V] a 4.0 b 4.5 c 5.0 1.1 a b c ID 24 22 20 18 16 14 12 10 8 6 4 a b c RDS (on) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 VGS [V] = a 4.0 4.5 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 h i j k 8.0 9.0 10.0 20.0 d 5.5 e 6.0 f 6.5 g 7.0 h 7.5 i j 8.0 9.0 d e f g h ji k k 10.0 l 20.0 2 0 0 4 8 12 16 20 V 28 0 4 8 12 16 20 A 28 VDS ID Typ. transfer characteristics ID = f (VGS) Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s VDS2 x ID x RDS(on)max 15 A 13 parameter: tp = 80 s, VDS2 x ID x RDS(on)max 20 S ID 12 11 10 9 8 7 6 5 4 3 2 gfs 16 14 12 10 8 6 4 2 1 0 0 0 1 2 3 4 5 6 7 8 V 10 0 2 4 6 8 10 VGS A ID 14 Semiconductor Group 6 07/96 BUZ 338 Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 8.5 A, VGS = 10 V 1.7 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 RDS (on) 1.4 98% VGS(th) 3.6 3.2 2.8 2.4 1.2 1.0 typ 2% 0.8 0.6 0.4 2.0 98% typ 1.6 1.2 0.8 0.2 0.0 -60 0.4 0.0 -60 -20 20 60 100 C 160 -20 20 60 100 C 160 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 1 Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s 10 2 nF C 10 0 A Ciss IF 10 1 Coss 10 -1 Crss 10 0 Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) 10 -2 0 10 -1 0.0 5 10 15 20 25 30 V VDS 40 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 07/96 BUZ 338 Avalanche energy EAS = (Tj ) parameter: ID = 13.5 A, VDD = 50 V RGS = 25 , L = 9.18 mH 1000 mJ Typ. gate charge VGS = (QGate) parameter: ID puls = 20 A 16 V EAS 800 700 600 500 400 300 VGS 12 10 0,2 VDS max 8 0,8 VDS max 6 4 200 100 0 20 2 0 40 60 80 100 120 C 160 0 20 40 60 80 100 120 140 160 nC 190 Tj Q Gate Drain-source breakdown voltage V(BR)DSS = (Tj ) 600 V 580 V(BR)DSS 570 560 550 540 530 520 510 500 490 480 470 460 450 -60 -20 20 60 100 C 160 Tj Semiconductor Group 8 07/96 BUZ 338 Package Outlines TO-218 AA Dimension in mm Semiconductor Group 9 07/96 |
Price & Availability of BUZ338
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |